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CHIPMOS TECHNOLOGIES INC-ADR

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$28.21 0.0014(0.14%) IMOS at 04 Dec 2025 04:35 PM Semiconductors
Lowest Today 27.94
Highest Today 28.06
Today’s Open 28.06
Prev. Close 28.03
52 Week High 30.98
52 Week Low 12.24
Day’s Range: Low 27.94 High 28.06
52-Week Range: Low 12.24 High 30.98
1 day return -
1 Week return -
1 month return +18.24
3 month return +59.53
6 month return +37.91
1 year return +39.18
3 year return +24.62
5 year return +9.33
10 year return -

Institutional Holdings

Renaissance Technologies Corp 3.25

BlackRock Inc 0.70

Dimensional Fund Advisors, Inc. 0.27

Renaissance Group LLC 0.25

JustInvest LLC 0.20

DFA Emerging Markets Core Equity 2 I 0.17

Envestnet Asset Management Inc 0.16

Creative Planning Inc 0.13

Rhumbline Advisers 0.11

Ballentine Finn & Company Inc 0.09

Parvin Asset Management, LLC 0.07

SignatureFD, LLC 0.06

DFA Emerging Markets Value I 0.05

Morgan Stanley - Brokerage Accounts 0.05

Sun Life Acadian International Eq I 0.04

Bank of America Corp 0.03

LPL Financial Corp 0.03

Citadel Advisors Llc 0.03

SEI International Equity Class F 0.03

LSV Asset Management 0.02

Parvin Hedged Equity Solari World 0.02

Harbor International Core Investor 0.02

Dimensional World ex US Core Eq 2 ETF 0.01

Parallel Advisors, LLC 0.01

Fidelity Nasdaq Composite Index 0.01

Wealthquest Corporation 0.01

Lindbrook Capital, LLC 0.01

SRS Capital Advisors Inc 0.01

Dimensional Emerging Markets Value ETF 0.01

DFA Emerging Markets Social Core Port 0.01

Dimensional Emerging Core Equity Mkt ETF 0.00

G.A. B World Equities Institutional Cap 0.00

Acadian All Ctry Wld ex US SCap Eq CL A 0.00

Dimensional EM Core Equity Acc 0.00

Renaissance International Small Cap Eq 0.00

Renaissance Intl Small Cap Eq Wrap 0.00

Dimensional Em Mkts ex China Cr Eq ETF 0.00

SA Emerging Markets Value 0.00

QRG QP: Factor EM ADR VQ 0.00

Blackstone Alternative Multi-Strategy I 0.00

Market Status

Fundamentals

Market Cap 976.85 M

PB Ratio 1.2718

PE Ratio 21.3969

Enterprise Value 942.76 M

Total Assets 45379.85 M

Volume 5979

Company Financials

Annual Revenue FY23:21356228000 21356.2M, FY22:23517064000 23517.1M, FY21:27400035000 27400.0M, FY20:23011381000 23011.4M, FY19:20337900000 20337.9M

Annual Profit FY23:3549425000 3549.4M, FY22:4912057000 4912.1M, FY21:7253978000 7254.0M, FY20:5032173000 5032.2M, FY19:3926100000 3926.1M

Annual Net worth FY23:1967565000 1967.6M, FY22:3371974000 3372.0M, FY21:5059069000 5059.1M, FY20:2378978000 2379.0M, FY19:2584200000 2584.2M

Quarterly Revenue Q3/2025:6143654000 6143.7M, Q2/2025:5735838000 5735.8M, Q1/2025:5532332000 5532.3M, Q3/2024:6068049000 6068.0M, Q2/2024:5809559000 5809.6M

Quarterly Profit Q3/2025:759706000 759.7M, Q2/2025:378834000 378.8M, Q1/2025:518388000 518.4M, Q3/2024:843425000 843.4M, Q2/2024:815332000 815.3M

Quarterly Net worth Q3/2025:352197000 352.2M, Q2/2025:-533061000 -533.1M, Q1/2025:176305000 176.3M, Q3/2024:299399000 299.4M, Q2/2024:450576000 450.6M

Fund house & investment objective

Company Information ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

Organisation Semiconductors

Employees 0

Industry Semiconductors

CEO Mr. Shih-Jye Cheng

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